MediaTek Dimensity 1050: What All To Expect?
The Dimensity 1050, Mediatek’s 1st system-on-chip (SoC) offering the quickest variant of 5G, joins the mmWave 5G fiesta.
The Dimensity 1050 is the first MediaTek CPU to handle simultaneous sub-6GHz and mmWave 5G connection, implying that MediaTek’s 5G chips would be accessible in even more nations.
Because it employs a 6nm technology, the Dimensity 1050 is identical to the Dimensity 1100 and Dimensity 1200 chips. The CPU configuration is comparable to that of the Dimensity 1100, except the Cortex-A78 in the Dimensity 1050 operates at 2.4GHz rather than 2.5GHz.
Mediatek is a significant supplier of cellphone processors, with those processors found in a range of products. The forthcoming Dimensity 1050 is an eight-core, 6nm CPU that Mediatek will manufacture alongside TSMC. The chipset supports the newest mmWave technology as well as 5G at sub-6GHz.
The most recent generation of wireless communication technology comes in a variety of varieties. The strongest 5G technology is mmWave, which utilizes 6GHz and greater bandwidth to give gigabit-level speeds.
Regrettably, mmWave has a very narrow range and accessibility through buildings. As a consequence, products that enable mmWave must also enable sub-6GHz frequency to offer connectivity in places where mmWave is not available.
The Dimensity 1050 succeeds on every level, combining mmWave and sub-6GHz capability with easy toggling between both the two.
The Dimensity 1050 is outfitted with 2x Arm Cortex-A78 productivity units running at 2.5GHz and 6x Arm Cortex-A55 efficiency units. The other’s clock frequency has not been disclosed.
TSMC’s 6nm technology is used to create the octa-core chipset. The novel processor’s key selling point is its connectivity with both mmWave and sub-6GHz 5G radio spectrum.
The firm has allegedly acquired or is pursuing licenses to trade in nations such as the United States and Japan. It is scheduled to appear on smartphones between July and September. It can support up to 108MP primary camera and up to 2x LPDDR5 RAM, UFS 3.1 storage, and WiFi 6E.
Together with MediaTek’s Miravision 760 video enhancement engine, the Dimensity 1050 processor enables 144Hz Full-HD+ screens. To use a dual HDR video record engine, the chipset can transmit concurrent streaming thru the smartphone’s front and back side camera.
There’s also the MediaTek APU 550, which supports artificial intelligence (AI)-based camera operations. The brand also says that minimal photos will benefit from improved sound insulation.
The MediaTek Dimensity 1050 processor has an octa-core CPU built on TSMC’s 6nm manufacturing technology. On sub-6GHz (FR1) frequency, the chipset provides a 3CC carrier combination, while on mmWave (FR2) frequency, it offers a 4CC carrier combination.
Devices equipped with the newest Dimensity 1050 chipset would be accessible in the third quarter, as per MediaTek.
What do you guys think about this new chipset? To my opinion, it seems so good. MediaTek has done a lot of improvements in this regard and I am excited to explore the power of this chipset on the forthcoming devices.
Although, it’s still unknown to us what all brands will opt for this chipset. But soon we are going to see this chipset embedded in most of the forthcoming devices in the third quarter.